Please use this identifier to cite or link to this item: https://gnanaganga.inflibnet.ac.in:8443/jspui/handle/123456789/2576
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dc.contributor.authorAbhinav-
dc.contributor.authorPrajwal, D-
dc.contributor.authorKumar, Punith-
dc.date.accessioned2023-12-19T05:08:55Z-
dc.date.available2023-12-19T05:08:55Z-
dc.date.issued2020-
dc.identifier.citationVol. 169; pp. 11-19en_US
dc.identifier.isbn9.78981E+12-
dc.identifier.issn2190-3018-
dc.identifier.urihttps://doi.org/10.1007/978-981-15-1616-0_2-
dc.identifier.urihttp://gnanaganga.inflibnet.ac.in:8080/jspui/handle/123456789/2576-
dc.description.abstractA two-dimensional numerical technique has been adopted to study the temperature rise, chip morphology, plastic stress/strain, strain hardening, and softening effect on the selected steel grades, namely S-1006, S-7, and S-4340 in the planing process. The material properties and constants are instituted on the popular Johnson–Cook (JC) constitutive model. A comparative analysis has shown, the maximum temperature rises in the case of S-7 (641.32 °C) followed by S-4340 (478.96 °C) S-1006 (287.19 °C). The temperature rise is mainly found in the secondary shear deformation zone and rise in shear stress found in the primary deformation zone. The plastic deformation is found facile in the case of S-1006 anticipated due to less dislocation within the crystal structure and work hardening effect found to be maximum in case of S-7 and the same is confirmed from the JC model material constants. It is believed that the simulation results may help in predicting machining uncertainties. © 2020, Springer Nature Singapore Pte Ltd.en_US
dc.language.isoenen_US
dc.publisherSmart Innovation, Systems and Technologiesen_US
dc.subjectEquivalent plastic strain and stressen_US
dc.subjectFEAen_US
dc.subjectJohnson–Cook constitutive modelen_US
dc.subjectTemperatureen_US
dc.subjectWork hardeningen_US
dc.titlePlaning Process on Aisi S-1006, S-7, and S-4340, Based on Johnson–Cook Model Using Numerical Techniqueen_US
dc.typeArticleen_US
Appears in Collections:Conference Papers

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