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DC Field | Value | Language |
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dc.contributor.author | B.P, Aniruddha Prabhu | - |
dc.contributor.author | Dani, Rakesh | - |
dc.contributor.author | Abdullah, Khairul Hafezad | - |
dc.contributor.author | Sharma, Tushar | - |
dc.contributor.author | Bhatt, Chandradeep | - |
dc.contributor.author | Chauhan, Rahul | - |
dc.date.accessioned | 2024-01-31T09:38:48Z | - |
dc.date.available | 2024-01-31T09:38:48Z | - |
dc.date.issued | 2024 | - |
dc.identifier.citation | Vol. 1097 LNEE ;pp. 3952 | en_US |
dc.identifier.isbn | 9789819972159 | - |
dc.identifier.issn | 1876-1100 | - |
dc.identifier.uri | https://doi.org/10.1007/9789819972166_4 | - |
dc.identifier.uri | http://gnanaganga.inflibnet.ac.in:8080/jspui/handle/123456789/5537 | - |
dc.description.abstract | Economic growth for good quality food contributed to packaging advancements. The topic of discussion in this research paper is intelligent packaging technologies, their applications in food packaging, as well as research and breakthroughs in the packaging industry. Food products with more intelligent and active packaging are both healthier and of higher quality. Active packaging makes use of additives to maintain or extend the quality and freshness of the food inside. During the entire process of storage and transportation, intelligent systems check packed foods for correct information. These advances satisfy the demand for foods that are healthier and can be stored for longer. It is anticipated that the market would expand as a result of the incorporation of active and intelligent packaging technologies. © The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd 2024. | en_US |
dc.language.iso | en | en_US |
dc.publisher | Lecture Notes in Electrical Engineering | en_US |
dc.subject | Active Packaging | en_US |
dc.subject | Food | en_US |
dc.subject | Intelligent Packaging | en_US |
dc.title | A Comprehensive Review of SensorBased Smart Packaging Technology | en_US |
dc.type | Article | en_US |
Appears in Collections: | Conference Papers |
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