Optimization of LTCC Structure for Stable Interconnections

Abstract

Reliability of electrical connections of a Low Temperature Co-fired Ceramics (LTCC) device is always a challenge. LTCC base plates are fabricated, over which a device or a sensor can be placed. Vias punched at the corners allows the provision for the electrical connection to the sensor. Conductive PdAg lines printed over the surface can be used to join the sensor part with the base plate using brazing technique. Cost of fabrication is lowered by punching the cavities using a zig fixture.