1. IR @ Alliance University
  2. Journal Articles Archive
  3. Articles to be qced
Please use this identifier to cite or link to this item: https://gnanaganga.inflibnet.ac.in:8443/jspui/handle/123456789/6690
Full metadata record
DC FieldValueLanguage
dc.contributor.authorDheeraj Kharbanda-
dc.contributor.authorP. K. Khanna-
dc.date.accessioned2024-02-27T05:59:32Z-
dc.date.available2024-02-27T05:59:32Z-
dc.date.issued2014-
dc.identifier.urihttp://gnanaganga.inflibnet.ac.in:8080/jspui/handle/123456789/6690-
dc.description.abstractReliability of electrical connections of a Low Temperature Co-fired Ceramics (LTCC) device is always a challenge. LTCC base plates are fabricated, over which a device or a sensor can be placed. Vias punched at the corners allows the provision for the electrical connection to the sensor. Conductive PdAg lines printed over the surface can be used to join the sensor part with the base plate using brazing technique. Cost of fabrication is lowered by punching the cavities using a zig fixture.-
dc.publisherManufacturing Technology Today-
dc.titleOptimization of LTCC Structure for Stable Interconnections-
dc.volVol 13-
dc.issuedNo 10-
Appears in Collections:Articles to be qced

Files in This Item:
File SizeFormat 
OPTIMIZATION OF LTCC STRUCTURE FOR STABLE INTERCONNECTIONS.pdf
  Restricted Access		883.23 kBAdobe PDFView/Open Request a copy
Show simple item record


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.