Development of Empirical Relationships to Predict Strength of P/M Sintered Pure Copper and Pure Nickel Diffusion Bonded Bimetallic Joints

Abstract

In the present study, pure copper (Cu) and pure nickel (Ni) plates prepared by powder metallurgy (P/M) method were bonded by diffusion bonding technique. From the literature, it was identified that the predominant diffusion bonding process parameters such as bonding temperature, holding time and bonding pressure influence the shear and bonding strength of diffusion bonded joints. In this investigation an attempt was made to develop empirical relationships to predict the shear strength and bonding strength of diffusion bonded bimetallic joints of pure Cu/Ni incorporating the above parameters using statistical tools such as design of experiments, analysis of variance and regression analysis. The developed empirical relationships can be used to predict the strength of Cu/Ni bimetallic joints at 95% confidence level.