Two-Side Pattern Generation Using Direct Lithography System

Abstract

This paper presents a process technique developed for Thin Film Pattern generation using PhotolithographyandWet Chemical Etching on two sides of substrate using Direct Lithography system for use in Thin Film Microwave Integrated Circuits (MICs). Pattern generation on two sides of the substrate is essential where the circuit involves Micro strip to Slotline transition and also where interconnections are required between two circuits positioned back-to-back in a trendy approach to achieve better performance and improved reliability. Direct Lithography is adopted for generation of critical Photo masks or Patterns directly on metallized substrates obviating the need of photo masks. Direct Patterning on substrates has the advantage of fine feature size and fast turn-around time. A method of pattern generation on two sides of the substrate is developed. Details on development of process technique are presented in the paper.