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DC Field | Value | Language |
---|---|---|
dc.contributor.author | Bal, Sasmita | - |
dc.date.accessioned | 2023-05-24T07:36:10Z | - |
dc.date.available | 2023-05-24T07:36:10Z | - |
dc.date.issued | 2022-05-05 | - |
dc.identifier.uri | 10.1615/ComputThermalScien.2022042219 | - |
dc.identifier.uri | http://gnanaganga.inflibnet.ac.in:8080/jspui/handle/123456789/709 | - |
dc.description.abstract | In this numerical investigation, three-dimensional Minichannel Heat Sink (MCHS) models with straight, triangular, chevron, and wavy channels having 1, 3, and 5 undulations, under 100,000 W/m2 input heat flux were investigated. Reynolds number and coolant inlet temperatures were varied from 50 to 300 and 10°C to 25°C, respectively. The effect of these parameters on pressure drop, base surface temperature, heat-transfer coefficient, etc., were investigated. Chevron geometry showed the highest cooling capability in terms of heat-transfer coefficient and base plate temperature. This configuration also exhibited the highest pressure drop and pumping power. Lowering of coolant inlet temperature from 25°C to 10°C resulted in base surface temperature drop in the range of approximately 17°C-30°C depending on Reynolds number. | en_US |
dc.language.iso | en | en_US |
dc.publisher | Begell House | en_US |
dc.subject | Chevron configuration | en_US |
dc.subject | Chip cooling | en_US |
dc.title | NUMERICAL INVESTIGATION OF COOLING BEHAVIOR IN MINICHANNEL HEAT SINK OF MULTIPLE CONFIGURATIONS | en_US |
dc.type | Article | en_US |
Appears in Collections: | Journal Articles |
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